Wireless control system, touch-sensitive module and manufacturing method of same

ABSTRACT

A wireless control system, a touch-sensitive pad structure, a touch-sensitive module and a method for manufacturing the touch-sensitive module are provided. The wireless control system includes a controlled device and a remote controller which includes the touch-sensitive module. The touch-sensitive module includes a plurality of sensor pads. The controlled device is controlled by detecting changes of physical properties of the sensor pads without touching the sensor pads.

FIELD OF THE INVENTION

The present disclosure relates to a wireless control system, andparticularly to a touch-sensitive module used in the wireless controlsystem and a manufacturing method of the touch-sensitive module.

BACKGROUND OF THE INVENTION

Gesture sensing/touch sensing technology has been widely used in 2D or3D control field and applied to household appliances and industrialequipments. For example, the technology is applied to TV remotecontrollers, touch screens, keyboards and in-vehicle control interfaces.

In a control device with gesture sensing/touch sensing function, atouch-sensitive module is configured to only receive data input. Thereceived data should be processed and then emitted through a signaltransmitting unit. Since more and more kinds of data input are utilizedto achieve intuitive control, the quantity of the touch-sensitivemodules rapidly increase and coupling between the touch-sensitivemodules and circuits/elements in the control device becomes muchcomplicated. Therefore, a novel touch-sensitive module with theadvantage of easy manufacturing process and simple coupling method isdesired.

SUMMARY OF THE INVENTION

An aspect of the present disclosure provides a touch-sensitive padstructure. The touch-sensitive pad structure includes a first sensorpad, a second sensor pad disposed beside the first sensor pad, and alead frame. The lead frame includes a main frame and a plurality offrame branches. Each frame branch has a first end and a second endwherein the first end is connected to one of the first sensor pad andthe second pad and the second end is connected to the main frame.

In an embodiment, the touch-sensitive pad structure includes anothersecond sensor pad and a wire electrically connecting the two secondsensor pads.

In an embodiment, the touch-sensitive pad structure further includes aprocessing chip. The processing chip is disposed on the first sensorpad, disposed in a hallow portion of the first sensor pad or disposedbetween the first sensor pad and the second sensor pad. The processingchip transmits or receives an electrical signal through one of the framebranches connected to the first sensor pad.

In an embodiment, the touch-sensitive pad structure further includes acircuit chip disposed between the first sensor pad and the second sensorpad and a plurality of wires. Each wire is electrically connected to thecircuit chip and one of the first sensor pad and the second sensor pad.

Another aspect of the present disclosure provides a touch-sensitivemodule. The touch-sensitive module includes a first sensor pad; a secondsensor pad disposed beside the first sensor pad; a wrapper covering thefirst sensor pad and the second sensor pad; and a plurality of leads.Each lead is electrically connected to one of the first sensor pad andthe second sensor pad, and protrudes from the wrapper to transmitelectrical signals generated by the first sensor pad or the secondsensor pad.

In an embodiment, the wrapper is made of an insulating material.

In an embodiment, the touch-sensitive module further includes aprocessing chip disposed on the first sensor pad, disposed in a hallowportion of the first sensor pad or disposed between the first sensor padand the second sensor pad. The processing chip is electrically connectedto the leads.

In an embodiment, the touch-sensitive module further includes a circuitchip and a plurality of wires. The circuit chip is disposed between thefirst sensor pad and the second sensor pad or disposed on one of thefirst sensor pad and the second sensor pad wherein the circuit chip, thefirst sensor pad and the second sensor pad are disposed on differentplanes with different heights. Each wire is electrically connected tothe circuit chip and one of the first sensor pad and the second sensorpad.

In one embodiment, the circuit chip is a light-emitting diode chipproviding various illuminating effects according to touch actions on thetouch-sensitive module.

In one embodiment, the first sensor pad and the second sensor pad aremade of a flexible material.

A further aspect of the present disclosure provides a wireless controlsystem. The wireless control system includes a touch-sensitive moduleand a controlled device. The touch-sensitive module includes a pluralityof sensor pads; a wrapper covering the sensor pads and receiving a touchaction; and a processing chip electrically connected to the sensor pads.The processing chip generates an internal control signal in response tochanges of physical properties of the sensor pads resulting from a touchaction near the wrapper in a first instance. The processing chip drivesthe sensor pads to change the physical properties of the sensor pads inresponse to an external control signal in a second instance. Thecontrolled device includes a sensing module configured to detect thechanges of the physical properties of the sensor pads behind the wrapperand generate a sensing signal wherein the controlled device iscontrolled in response to the sensing signal.

In an embodiment, the controlled device achieves authentication of thetouch-sensitive module according to the sensing signal.

In an embodiment, the physical property is capacitance.

A further aspect of the present disclosure provides a method formanufacturing a touch-sensitive module. At first, a first sensor pad, asecond sensor pad and a lead frame are formed. The lead frame includes amain frame and a plurality of frame branches. Each frame branch has afirst end and a second end wherein the first end is connected to one ofthe first sensor pad and the second sensor pad, and the second end isconnected to the main frame. Then, a wrapper covering the first sensorpad and the second sensor pad is formed. The main frame is removed toform the touch-sensitive module wherein leads connected to the firstsensor pad and the second sensor pad are formed from the frame branches.The leads protrude from the wrapper.

In an embodiment, the first sensor pad, the second pad and the leadframe are integrally formed by a metal stamping process. The wrapper isformed by injection molding. The main frame is removed by a cuttingprocess.

BRIEF DESCRIPTION OF THE DRAWINGS

The advantages of the present disclosure will become more readilyapparent to those ordinarily skilled in the art after reviewing thefollowing detailed description and accompanying drawings, in which:

FIG. 1 is a schematic diagram illustrating a wireless control system;

FIG. 2 is a schematic diagram illustrating a structure of a capacitivetouch-sensitive module according to an embodiment of the presentinvention;

FIG. 3 is a schematic diagram illustrating a capacitive touch-sensitivepad structure including a lead frame according to an embodiment of thepresent invention;

FIG. 4A is a top view illustrating a capacitive touch-sensitive padstructure including a lead frame according to another embodiment of thepresent invention;

FIG. 4B is a cross-sectional side view of a capacitive touch-sensitivemodule manufactured from the capacitive touch-sensitive pad structure ofFIG. 4A;

FIG. 5 is a side view of a capacitive touch-sensitive module having aLED unit according to a further embodiment of the present invention;

FIG. 6 is a perspective view illustrating an input device having thetouch-sensitive module;

FIG. 7 is a schematic diagram illustrating a button of a keypad havingthe touch-sensitive module;

FIGS. 8A-8C are top views illustrating capacitive touch-sensitive padstructures according to further embodiments of the present invention;and

FIG. 9 is a schematic diagram illustrating a touch-sensitive module withfingerprint authentication function according to the present disclosure.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

The present disclosure will now be described more specifically withreference to the following embodiments. It is to be noted that thefollowing descriptions of preferred embodiments of this invention arepresented herein for purpose of illustration and description only. It isnot intended to be exhaustive or to be limited to the precise formdisclosed.

Please refer to FIG. 1, a schematic diagram illustrating a wirelesscontrol system. The wireless control system 10 at least includes aremote controller 100 and a controlled device 150. The controlled device150 includes a sensing module 152 which can handshake with the remotecontroller 100 to establish a communication channel therebetween.Therefore, the remote controller 100 can issue control signals tocontrol the controlled device 150. The remote controller 100 may furtherinclude a touch-sensitive module 130 for sensing touch actions/gesturesof the user and transforming the sensed touch actions/gestures intoremote control signals for operating a user interface (not shown) of thecontrolled device 150. To be specific, the touch-sensitive module 130 isa capacitive touch-sensitive module.

The structure of a capacitive touch-sensitive module is shown in FIG. 2.The capacitive touch-sensitive module 130 includes several sensor pads.In this embodiment, there are a first sensor pad 21 and six secondsensor pads 22 surrounding the first sensor pad 21. It is to be notedthat the shape, the number and the relative positions of the sensor pads21 and 22 are not limited to this embodiment and any proper modificationto them are involved in the present disclosure. The layout of the sensorpads 21 and 22 is arranged in a one-dimensional mode. The sensor pads 21and 22 are electrically isolated from each other. For each sensor pad 21or 22, capacitance changes with approaching of a touch object such as afinger. Electrical signals generated by the sensor pads 21 and 22 aretransmitted to a processing chip (not shown) through corresponding leads20, respectively. The capacitive touch-sensing module 130 and theprocessing chip are covered and protected by a wrapper 31. Theprocessing chip can determine user touch actions/gestures fromposition(s)/position change of the touch object by certain operation.Therefore, user touch actions/gestures near the sensor pads 21 and 22can be sensed to generate control signals for operating the userinterface of the controlled device 150. The detailed description can beread from patent applications of TW 201415334, US 2014/0097857 and US2014/0097885, which are incorporated herein for reference.

To simplify the manufacturing method of the one-dimensional capacitivetouch-sensitive module, a lead frame is used. A touch-sensitive padstructure which can be considered as a semiproduct of thetouch-sensitive module 130 is shown in FIG. 3. The sensor pads 21 and 22are connected to a lead frame 30 respectively. The lead frame 30includes a main frame 301 and several frame branches 302. Each framebranch 302 has a first end 3021 and a second end 3022 wherein the firstend 3021 and the second end 3022 are connected to only one sensor pad(21 or 22) and the main frame 301, respectively. The main frame 301 andthe frame branches 302 of the lead frame 30 together with the sensorpads 21 and 22 form a planar structure and can be easily manufactured bya metal stamping process to provide an integrally-formed product. Ifnarrow line width is required, an etching method is applicable. Thematerial of the touch-sensitive pad structure may be metal, conductivepolymer, conductive rubber or other conductive material which can beprocessed by stamping or etching. A flexible material, e.g. theconductive rubber, is a better choice among these materials. In analternative embodiment, the touch-sensitive pad structure may be formedby covering nonconductive material with conductive material, forexample, plastic body electroplated with metal layer. Then, the wholestructure except the main frame 301 is covered by a wrapper 31 to fixand protect the sensor pads 21 and 22. In an embodiment, the wrappingprocedure is performed by injection molding, and then the main frame 301is removed by cutting along the dotted line. Thus, the capacitivetouch-sensitive module of FIG. 2 is obtained. The touch surface of thewrapper 31 may be a plat surface or a curved surface, and the wrapper 31is made of an insulating material. The material of the wrapper 31 may betransparent, translucent or opaque. The leads 20 (formed from the framebranches 302) of the touch-sensitive module 130 protrude from thewrapper 31. The leads 20 are electrically connected to a ribbon cable(not shown) so that the electrical signals generated by the sensor pads21 and 22 can be transmitted to other circuits or elements through theleads 20 and the ribbon cable. Therefore, a touch control module (notshown) cooperated with the touch-sensitive module 130 can beelectrically connected to the leads 20 through suitable signal lines todetermine the sensed gestures/touch actions by certain operation of theelectrical signals from the touch-sensitive module 130.

Please refer to FIG. 4A and FIG. 4B illustrating another embodiment ofthe present invention. In this embodiment, the processing chip 40 isintegrated in the touch-sensitive module 130. There is a hollow portion210 in the first sensor pad 21 for accommodating the processing chip 40.The sensor pads 21 and 22, the lead frame 30 and the processing chip 40are disposed on a substrate 41 (FIG. 4B). The leads 20 (formed from thelead branches 302) are electrically connected to the processing chip 40via wire bonding, while the processing chip 40 is also electricallyconnected to pins 49 via wire bonding. The substrate 41 may beimplemented by a heat sink. In addition, the substrate 41 may include ametal layer (not shown) to serve as a ground plane to shield againstelectrical noise and interference. Furthermore, a driving voltage may besupplied on the sensor pads 21 and 22 via the metal layer to increasesensitivity and sensible distance of the touch-sensitive module 130. Asdescribed in the above embodiment, the lead frame 30 may be integrallyformed by a metal stamping process. The wrapper 31 is formed to coverthe whole structure except the main frame 301, i.e. covering the sensorpads 21 and 22, the frame branches 302, the processing chip 40 and thesubstrate 41. For example, the wrapping procedure is performed byinjection molding, and then the main frame 301 is removed by cutting thewhole structure along the dotted circle. The touch surface of thewrapper 31 may be a plat surface or a curved surface, and the wrapper 31is made of an insulating material. The material of the wrapper 31 may betransparent, translucent or opaque. In another embodiment, theprocessing chip 40 may be disposed between two of the sensor pads 21 and22. In a further embodiment, the processing chip 40 may be disposed onone of the surfaces of the sensor pads 21 and 22. Under this condition,an insulating layer (not shown) is interposed between the processingchip 40 and the underlying sensor pad 21 or 22, or pins of theprocessing chip 40 are electrically connected to the underlying sensorpad 21 or 22. In addition to the processing chip 40, a battery, awireless communication chip or other circuit chip which is required forthe remote controller 100 may be disposed in and integrated into thetouch-sensitive module 130 in the same manner. The circuit chip iswrapped together with the sensor pads 21 and 22 and the leads 20.

According to the present disclosure, the touch-sensitive module haslimited sensor pads. The concept of the present disclosure is breakingup the whole into parts. The size of the remote controller 100 can begreatly reduced, e.g. like a button. Therefore, the present disclosuregains advantage over other remote controller. Furthermore, onetouch-sensitive module 130 may be solely provided in a remote controller100 to perform the touch-sensing action, or several touch-sensitivemodules 130 may be combined together to provide a large-areatouch-sensitive module. Besides, several small touch-sensitive modulescan be disposed at different areas of the remote controller 100 toachieve flexible design and application. Although the capacitivetouch-sensitive module 130 is described in the above embodiments forillustration, it is to be noted that other type of touch-sensitivemodule is also applicable for all embodiments, e.g. piezoelectrictouch-sensitive module whose sensor pads are made of piezoelectricmaterial capable of sensing pressure.

If the wrapper 31 is transparent or translucent, a light-emitting diode(LED) unit controlled by the processing chip 40 may be displaced withinthe wrapper 31. The brightness and/or color of the light-emitting diodeunit changes with the touch-sensing result of the sensor pads 21 and 22.In other words, the light-emitting diode unit provides variousilluminating effects according to the sensed gesture/touch action.Please see the structure in FIG. 5 wherein the transparent wrapper 31 isnot shown for clarity and a heat sink is additionally provided. In thestructure, a metal layer 431 is formed in a similar way to the sensorpads in the above embodiments. A great portion of the metal layer 431serves as a conductive portion of the heat sink 43 which is connected tothe light-emitting diode unit 42 by an insulating thermal paste 432.Another portion of the metal layer 431 serves as sensor pads. The sensorpads and the light-emitting diode unit 42 are electrically connected tothe processing chip 40 by wires 44 so that the processing chip 40 canprocess touch-sensing action of the sensor pads and control illuminationof the light-emitting diode unit 42.

The touch-sensitive modules in the above embodiments may be used indifferent types of input devices, e.g. input devices for computers orother information systems. FIG. 6 shows a joystick having atouch-sensitive module according to the present disclosure. The joystick50 includes a base 52 and a stick 53. The touch-sensitive module 51 isdisposed at a top of the stick 53. The user moves the stick 53 ortouches the touch-sensitive module 51 to control movement of a cursor oran object on the screen. For better control, moving the stick 53 resultsin fast movement of the cursor or object, while operating thetouch-sensitive module 51 results in fine movement of the cursor orobject. Therefore, the user can move the stick 53 to rapidly move thecursor near a target position, and then wag his finger or pass hisfinger over the touch-sensitive module 51 to move the cursor to theprecise target position. The control chip (not shown) corresponding tothe stick 53 and the processing chip of the touch-sensitive module 51may be separately provided in the joystick 50 or integrated in one chipaccording to the real application. For other applications, thetouch-sensitive module 51 is provided as a user interface mounted in avehicle or a cabin of a boat to be operated by a driver/pilot orpassengers.

Furthermore, the touch-sensitive module of the present disclosure cansense floating touch. Therefore, the touch-sensitive module can sensefinger movement parallel to the touch surface of the ouch-sensitivemodule and finger movement toward/away from the touch-sensitive module.According to this technology, a virtual key is formed above the touchsurface of the touch-sensitive module. To sense floating touch, overallcapacitance change of a group of sensor pads can be calculated todetermine the distance between the touch surface and the user finger,palm or other conductive touch object. There is predefined relationbetween the number of the sensor pads and the sensible distance. Forexample, seven sensor pads can sense larger range than three sensor padsby detecting overall capacitance change of the sensor pads. Detaileddescription about grouping of sensor pads can be read from patentapplications of TW 201415334, US 2014/0097857 and US 2014/0035865, whichare incorporated herein for reference. Since the sensible distance ofthe capacitive touch-sensitive module is determined by the groupingsize, continuing changing the grouping size can be considered as a scanaction toward/away from the capacitive touch-sensitive module. After theuser operate the capacitive touch-sensitive module to move a cursor toan icon on a panel including the touch-sensitive module, when the userfinger moves toward the panel, the capacitive touch-sensitive module candetect this “press” action and make the icon deform such as curvinginward to respond to the “press” action. For example, when thecapacitive touch-sensitive module detects and realizes that the distancebetween the panel and the user finger becomes smaller than a thresholddistance value, animation effects to the icon, e.g. rupture may beshown. Then, the panel performs a specific function represented by theicon.

Please refer to FIG. 7 showing a button of a keypad or a keyboard. Thebutton 60 includes a keycap 61 and a keyswitch 62 wherein thetouch-sensitive module 63 is disposed in the keycap 61 of the button 60.On one hand, the buttons 60 with the touch-sensitive module 63 arepressed to provide character or functional input. One the other hand,one or more buttons 60 with the touch-sensitive module 63 can serve as atouchpad. The touch-sensitive module 63 senses touch action on thebutton(s) 60 to control the cursor or object to move on the informationsystem. Polar coordinate system is used in movement control of thecursor or object. For example, the touch-sensitive module 63 senses adistance and an angle of the touch point relative to a fixed centerpoint. Thus, the cursor is controlled to move according to the senseddistance and angle. The velocity of the cursor is in proportion to thedistance and the moving direction corresponds to the angle.

Please refer back to FIG. 1. The sensing module 152 of the controlleddevice 150 may be implemented by the above-described touch-sensitivemodule. The processing chip 40 of the touch-sensitive module 130 issuesdifferent voltage signals to drive the sensor pads 21 and 22 of thetouch-sensitive module 130 in response to an external control signal.The voltage signal distribution among the sensor pads 21 and 22 may beconsidered as a code. Furthermore, the voltage signals may haverapid-switching/changing waveforms to change the voltage signaldistribution with time. Each remote controller 100 has its own code(s)to be recognized. The sensing module 152 with floating touch functioncan detect the capacitance changes between the touch-sensitive module130 and the sensing module 152 to generate a corresponding sensingsignal. Thus, the controlled device 150 can decide whether thecommunication channel should be established according to the sensingsignal indicating the capacitance changes corresponding to the code(s)of the remote controller 100. Thus, authentication of the remotecontroller 100 is achieved. It is to be noted that capacitivetouch-sensing function is described for illustration. In fact, thetouch-sensing module 130 and the sensing module 152 can achieve theauthentication through other touch-sensing method. It is only requiredthat physical properties of the sensor pads of the touch-sensing module130 are changed in a particular mode, and the sensing module 152 candetect the changes of the physical properties.

In this embodiment, the processing chip 40 can receive or issue controlsignals in different situations. In a first instance, the processingchip 40 detects the changes of the physical properties (e.g. capacitancechanges) of the sensor pads resulting from an approaching touch object,and issues an internal control signal to control a designated element(not shown). In as second instance, the processing chip 40 receives anexternal control signal from other control element (not shown). Theprocessing chip 40 drives the sensor pads and changes the physicalproperties (e.g. capacitance changes) of the sensor pads in a particularmode in response to the external control signal.

Please refer to FIG. 8A, a top view illustrating a capacitivetouch-sensitive pad structure according to the present disclosure. Thecapacitive touch-sensitive pad structure 70 is manufactured by a metalstamping process. The capacitive touch-sensitive pad structure 70includes a first sensor pad 701, second sensor pads 702 and a lead frame703. The lead frame 703 includes a main frame 7032 and several framebranches 7031. Each frame branch 7031 has a first end 70311 and a secondend 70312 wherein the first end 70311 is connected to only one sensorpad (701 or 702) and the second end 70312 is connected to the main frame7032. The two second sensor pads 702 are electrically connected via wirebonding. The wire 71 across the first sensor pad 701 is isolated fromthe first sensor pad 701. Then, the capacitive touch-sensitive padstructure 70 except the main frame 7032 is wrapped by, for example,injection molding. The pad structure 70 is cut along the dotted square79 to remove the main frame 7032 and a portion of the frame branches7031 to obtain the capacitive touch-sensitive module. A plurality of thecapacitive touch-sensitive modules may be combined in a regular patternto from a touch panel. Therefore, the manufacturing process is flexibleto provide the touch panels with various sizes by combining properquantity of the touch-sensitive modules.

FIG. 8B illustrates another capacitive touch-sensitive pad structureaccording to the present disclosure. The capacitive touch-sensitive padstructure 80 is manufactured by a metal stamping process. The capacitivetouch-sensitive pad structure 80 includes a first sensor pad 801, asecond sensor pad 802, power pads 808, grounding pads 809, signal pads810 and a lead frame 803. The lead frame 803 includes a main frame 8032and several frame branches 8031. Each frame branch 8031 has a first end80311 and a second end 80312 wherein the first end 80311 is connected toone of the first sensor pad 801, the second sensor pad 802, the powerpads 808, the grounding pads 809 and the signal pads 810, while thesecond end 80312 is connected to the main frame 8032. The dotted square87 indicates where a circuit chip 870 may be disposed. The power pads808, the grounding pads 809 and the signal pads 810 are respectivelyelectrically connected to the circuit 870 via wires 81, 82 and 83 bywire bonding, but the present disclosure are not limited to thisinterconnection method. Then, a portion of the capacitivetouch-sensitive pad structure 80 is wrapped by, for example, injectionmolding. The main frame 8032 and a portion of the frame branches 8031are cut off to form the capacitive touch-sensitive module with theembedded circuit chip 870. A plurality of the capacitive touch-sensitivemodules may be combined in a regular pattern wherein the embeddedcircuit chips 870 are selected from more than one circuit chip, e.g.light-emitting diode chip and/or sensor chip. In this instance, thelight-emitting diode chip is controlled by control signals receivedthrough the signal pads 810. Alternatively, the sensor chip issuessensed parameters through the signal pads 810. For example, the sensorchip is a piexoelectric sensor capable of sensing pressure exerted onthe sensor pads. It is to be noted that the present disclosure does notlimit the location of the circuit chip 870. The circuit chip 870 may bedisposed among the sensor pads, disposed in a hallow portion of onesensor pad or mounted on a surface of one of the pads 801, 802, 808, 809and 810 by an insulating adhesive material. The surface is a topsurface, a bottom surface or a lateral surface of the pad.

FIG. 8C illustrates another capacitive touch-sensitive pad structureaccording to the present disclosure. The structure is similar to thestructure shown in FIG. 8B except that the signal pads 810 areeliminated. In this instance, the external signals are received throughthe first sensor pad 801 and the second pad 802. The circuit chip 870 iselectrically connected to the first sensor pad 801 and the second pad802 by wires 86 and 85. Thus, by taking advantage of time-divisionmultiplexing (TDM) method, the first sensor pad 801 and the secondsensor pad 802 are driven to perform touch-sensing actions during firsttime slots, and controlling of the circuit chip 870 is performed duringsecond time slots. For other cases, the circuit chip 870 is disposed ona surface of the first sensor pad 801 or the second sensor pad 802.Under this condition, an insulating layer (not shown) is interposedbetween the circuit chip 870 and the underlying sensor pad 801 or 802,or pins of the circuit chip 870 are electrically connected to theunderlying sensor pad 801 or 802. If the circuit chip is alight-emitting diode chip, and a P-type electrode or a N-type electrodeis formed at a bottom of the light-emitting diode chip, thelight-emitting diode chip can be directly disposed on the first sensorpad 801 or the second sensor pad 82 to form electrical connectionbetween them without any wire.

FIG. 9 illustrates a touch-sensitive module with fingerprintauthentication function. In this touch-sensitive module, two circuitchips 971 and 972 are provided, e.g. light-emitting diode chip 971 andimage sensor chip 972. The circuit chips 971 and 972 may be disposed asdescribed in the above embodiments, e.g. disposed between two sensorpads, disposed in a hallow portion of one sensor pad, mounted on asurface of one sensor pad by an insulating adhesive material, ordisposed at other proper position. Thus, the light-emitting diode chip971 and the image sensor chip 972 can detect a fingerprint of the finger9 touching the protection structure 900 (e.g. a wrapper with or withouta cover lens). When the touch-sensitive module is idle, the circuitchips 971 and 972 are off to decrease power consumption. Once the sensorpads 901, 902 and 903 detect that a user finger touches the protectionstructure 900, the circuit chips 971 and 972 are switched on to performfingerprint authentication. After passing the fingerprintauthentication, the user can perform further touch operation on thetouch-sensitive module. The sensor pads 901, 902 and 903 and the circuitchips 971 and 972 are wrapped by injection molding. The protectionstructure 900 is made of a transparent material. Nevertheless, if theprotection structure 900 is translucent or opaque, a through hole or alight-guiding element may be provided on the light path to allow thelight transmission.

The lead frame, the sensor pads, the heat sink and the circuit chip maybe arranged on the same plane or at different heights and angles. Thepresent disclosure does not limit the relative positions of them. Thelayout varies to meet different requirements. For example, theilluminating surface of the light-emitting diode chip is orthogonal tothe lead frame.

In conclusion, the wireless control system, the touch-sensitive moduleand the touch-sensitive pad structure according to the presentdisclosure can satisfy wide requirements for remote control or touchcontrol. The modular design of the touch-sensitive module enhances theflexibility and the application of the present disclosure. The proposedtouch-sensitive pad structure facilitates simplifying the manufacturingmethod of the touch-sensitive module.

While the disclosure has been described in terms of what is presentlyconsidered to be the most practical and preferred embodiments, it is tobe understood that the invention needs not be limited to the disclosedembodiment. On the contrary, it is intended to cover variousmodifications and similar arrangements included within the spirit andscope of the appended claims which are to be accorded with the broadestinterpretation so as to encompass all such modifications and similarstructures.

What is claimed is:
 1. A touch-sensitive module, comprising: a firstsensor pad; a second sensor pad disposed beside the first sensor pad; awrapper covering the first sensor pad and the second sensor pad andfilling a space between the first sensor pad and the second sensor pad;and a plurality of leads each of which is electrically connected to oneof the first sensor pad and the second sensor pad, and protrudes fromthe wrapper to transmit electrical signals generated by the first sensorpad or the second sensor pad.
 2. The touch-sensitive module according toclaim 1 wherein the wrapper is made of an insulating material.
 3. Thetouch-sensitive module according to claim 1, further comprising aprocessing chip disposed on the first sensor pad, disposed in a hallowportion of the first sensor pad or disposed between the first sensor padand the second sensor pad, the processing chip being electricallyconnected to the leads.
 4. The touch-sensitive module according to claim1, further comprising: a circuit chip disposed between the first sensorpad and the second sensor pad or disposed on one of the first sensor padand the second sensor pad wherein the circuit chip, the first sensor padand the second sensor pad are disposed on different planes withdifferent heights; and a plurality of wires each of which iselectrically connected to the circuit chip and one of the first sensorpad and the second sensor pad.
 5. The touch-sensitive module accordingto claim 4, wherein the circuit chip is a light-emitting diode chipproviding various illuminating effects according to touch actions on thetouch-sensitive module.
 6. The touch-sensitive module according to claim1 wherein the first sensor pad and the second sensor pad are made of aflexible material.
 7. A wireless control system, comprising: atouch-sensitive module comprising: a plurality of sensor pads; a wrappercovering the sensor pads and receiving a touch action; and a processingchip electrically connected to the sensor pads, the processing chipgenerating an internal control signal in response to changes of physicalproperties of the sensor pads resulting from a touch action near thewrapper in a first instance, the processing chip driving the sensor padsto change the physical properties of the sensor pads in response to anexternal control signal in a second instance; and a controlled devicecomprising a sensing module, the sensing module detecting the changes ofthe physical properties of the sensor pads behind the wrapper andgenerating a sensing signal wherein the controlled device is controlledin response to the sensing signal.
 8. The wireless control systemaccording to claim 7 wherein the controlled device achievesauthentication of the touch-sensitive module according to the sensingsignal.
 9. The wireless control system according to claim 7, wherein thephysical property is capacitance.
 10. A method for manufacturing atouch-sensitive module, comprising steps of: forming a first sensor pad,a second sensor pad and a lead frame, the lead frame comprising a mainframe and a plurality of frame branches, each of the frame brancheshaving a first end and a second end wherein the first end is connectedto one of the first sensor pad and the second sensor pad, and the secondend is connected to the main frame; forming a wrapper covering the firstsensor pad and the second sensor pad; and removing the main frame toform the touch-sensitive module wherein leads connected to the firstsensor pad and the second sensor pad are formed from the frame branches,the leads protruding from the wrapper.
 11. The method according to claim10, wherein the first sensor pad, the second pad and the lead frame areintegrally formed by a metal stamping process, the wrapper is formed byinjection molding, and the main frame is remove by a cutting process.12. A touch-sensitive module, comprising: a first sensor pad; a secondsensor pad disposed beside the first sensor pad; a first circuit chipdisposed between the first sensor pad and the second sensor pad ordisposed on one of the first sensor pad and the second sensor pad; asecond circuit chip disposed between the first sensor pad and the secondsensor pad or disposed on one of the first sensor pad and the secondsensor pad; and a wrapper covering the first sensor pad, the secondsensor pad, the first circuit chip and the second circuit chip, thefirst circuit chip and the second circuit chip being switched on if thesensor pads detect a touch operation on the touch-sensitive module. 13.The touch-sensitive module according to claim 12, wherein the firstcircuit chip and the second circuit chip are a light-emitting diode chipand an image sensor chip, respectively, to sense a fingerprint duringthe touch operation.